High precision sensing in the size of a stamp

With the E3T-FL, the highest sensing accuracy has been achieved for the first time in a housing just 3.5 mm thick and only the size of a postage stamp. The innovative LED mounting technology enables the realization of stable background suppression for reliable detection of differently coloured objects without background or ambient light influence.

First mounted flip-chip in industry
Flip-chip mounting technology, the ultimate in miniature mounting technology for attaching IC chips without covering them in resin, makes the slim structure of the E3T-FL possible. The E3T-FL is just 3.5 mm wide, even with a two-part light receiving element on the surface of the circuit board and a signal processing IC on the rear. Flip-chip mounting of the IC has enabled the mounting volume to be kept to the absolute minimum.

High-precision alignment technology
The E3T-FL sensing distances are subtly controlled using high-precision alignment technology, which aligns the optical axes of more than one part. The light receiving lens with its unique thinwalled structure is automatically adjusted inline to keep sensing distance fluctuations to a minimum.

Features and benefits:

• Ultra small size with high power pinpoint LED, where space is crucial
  
• 3.5 mm thin flat shape
  
• Pulse synchronisation for high ambient light immunity
  
• Flat background supression (BGS) with highest repeatability even for differently coloured objects